SK Hynix held a groundbreaking for an advanced memory packag
文 / 小金
2026-08-27 23:30:03
来源:亚金网
SK Hynix held a groundbreaking for an advanced memory packaging plant in Lafayette, Indiana, investing more than $4.0 bln on a 133.5-acre site to build its first U.S. high-bandwidth memory (HBM) packaging base. The company said the plant cleanroom is expected to be operational by October 2028, with next-generation HBM mass production targeted in H2 2029; full operations are expected to employ about 1,000 staff.
