JP Morgan now expects tech-related corporate bond issuance t
文 / 小金
2026-08-08 03:30:04
来源:亚金网
JP Morgan now expects tech-related corporate bond issuance to exceed $500bn this year and has raised its 2026 TMT debt forecast to $540bn from $450bn, citing AI-led capex by large tech firms. The bank says chip-backed financing will be the next major frontier for AI infrastructure and could grow to several trillion dollars by the end of the decade. JP Morgan has identified seven additional investment-grade data-center financing opportunities beyond six already completed deals; four are expected to involve ORACLE and OpenAI. The bank expects Meta Platforms to return to the bond market after its Q3 results, while Microsoft is the biggest wildcard and could tap bond investors for the first time since 2017.
